In recent years, NP303 series (Sn-3.0Ag-0.5Cu) was commonly used by the industry and treated as the first generation of Pb-free soldering composition. However, with metal price worldwide continue to skyrocket, higher silver cost comes into effect for the whole electronics manufacturing industry. How to control cost and maintain quality become a serious issue. With reference to the recommendation of Japan Electronics and Information Technology Industries Association (JEITA) for Low-Ag Alloy, Nihon Genma developed new NP103 Series (Sn-0.3Ag-0.7Cu) which compose with less sliver content to facilitate different client needs.