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Solder Product > Solder Cream > NP303 Series
 

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Solder paste supporting high-temperature preheating.


Specification/Feature:
  Product Code: NP303-GM775-GQ
  Alloy Composition: Sn-3.0Ag-0.5Cu
  Melting Point (°C): 217-221
  Particle Size (µm): 38-22
  Flux content (wt%): 11.0±0.3
  Halide content max (ppm): 0.05
  Features: For high temperature pre-heat


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