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Solder Product > Solder Cream > NP303 Series
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Specification/Feature:
Product Code:
NP303-GM855-GK
Alloy Composition:
Sn-3.0Ag-0.5Cu
Melting Point (°C):
217-221
Particle Size (µm):
45-22
Flux content (wt%):
10.5 ± 0.3
Halide content max (ppm):
0.07 ± 0.09
Features:
Excellent wettability
E-Catalogue
