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Solder Cream
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NP303 Series
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Solder Product > Solder Cream > NP303 Series
Specification/Feature:
Product Code:
NP303-LHGQ-27KR
Alloy Composition:
Sn-3.0Ag-0.5Cu
Melting Point (°C):
217-221
Particle Size (µm):
38-22
Flux content (wt%):
11.0 ± 0.3
Halide content max (ppm):
< 1500
Features:
Low-Halogen type
