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Solder Cream
NP103 Series
NP303 Series
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Solder Product > Solder Cream > NP303 Series
Specification/Feature:
Product Code:
NP303-ZYA-1
Alloy Composition:
Sn-3.0Ag-0.5Cu
Melting Point (°C):
217-221
Particle Size (µm):
25-10
Flux content (wt%):
12.0 ± 0.3
Halide content max (ppm):
0.02 ± 0.01
Features:
For fine pitch PCB and components